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AN11689 recommendations for p cb assembly of dsn1006 rev. 1 ? 29 july 2015 application note document information info content keywords dsn1006, dsn1006-2, dsn1006u-2 , sod993, sod995, 0402 package size, reflow soldering, surface moun t, solder paste, stencil aperture, printed-circuit board (pcb), solder mask defined (smd), footprint, landing pattern, pick and place, chip-scale package (csp) abstract this application note provides guidelines for board assembly of the ultra-small dsn1006 (1.0 ? 0.6 mm 2 ) chip-scale package. the main focus is on recommendations for reflow soldering. for general information about footpr int design and reflow soldering see application note an10365 (surface mount reflow soldering description).
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 2 of 18 contact information for more information, please visit: http://www.nxp.com for sales office addresses, please send an email to: salesaddresses@nxp.com nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 revision history rev date description 1 20150729 initial version
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 3 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 1. introduction due to the trend of reduced dimensions and increased density of functionality in smartphones and other mobile devices, there is an increasing request from the industry for extremely small components. nxp supports this trend with the new dsn1006-2 (sod993, symmetrical contacts) and dsn1 006u-2 (sod995, asymmetrical contacts) packages. they are ultra small surface-mount chip-scale diode packages with a size of only 1.0 mm ? 0.6 mm ? 0.27 mm (0402). due to the very sma ll size of the component, nxp investigated the board assembly process intensively in order to offer board mounting recommendations. this includes pcb mounting pads, stencil ape rtures, solder paste and board assembly process parameters. using the recommended dimensions for pads and stencil as described in this document will help to achieve: ? optimum stand-up height ? minimum tilt ? minimum rotation ? good board assembly process performance while this application note helps minimizing any unexpected failures, following the advice in this document is not a guarantee for a perfect surface-mount technology (smt) assembly result. the results may differ depending on the machine capability, ambient conditions, material, etc. 2. dsn1006 (sod993, sod995): package details dsn1006-2 (sod993) and dsn1006u-2 (sod 995) are discrete silicon no-leads (dsn) packages. they feature tin (sn) plated metal contacts under the package (bottom terminations) similar to di screte flat no-leads (dfn) style packages. the dsn-style package allows 100 % utilization of the pack age area for active silicon, offering a significant performance advantage per board area compared to products in plastic-molded packages. key features: ? ultra small and flat package (1.0 ? 0.6 ? 0.27 mm 3 ) ? sn-plated contacts for soldering on pcb ? symmetrical contact pads for dsn1006-2 (sod993) ? asymmetrical contact pads for dsn1006u-2 (sod995) the visual appearance of dsn1006-2 (sod993) is shown in figure 1 whereas figure 2 shows the package dimensions. the visual appearance of dsn100 6u-2 (sod995) is shown in figure 3 whereas figure 4 shows the package dimensions.
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 4 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 fig 1. dsn1006-2 (sod993): visual appearance fig 2. dsn1006-2 (sod993): package dimensions references outline version european projection issue date iec jedec jeita sod993 sod993_po 14-10-24 14-10-24 unit mm max nom min 0.30 0.03 0.65 1.05 0.65 a dimensions (mm are the original dimensions) dsn1006-2, leadless ultra small package; 2 terminals; body 1.0 x 0.6 x 0.27 mm sod993 a 1 b 0.51 0.55 0.95 0.49 dee 1 0 0.5 mm scale a a 1 e d l l b b 12 0.26 0.24 l 0.24 (1) note 1. the marking bar indicates the cathode. e 1
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 5 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 fig 3. dsn1006u-2 (sod995): visual appearance fig 4. dsn1006u-2 (sod995): package dimensions references outline version european projection issue date iec jedec jeita sod995 sod995_po 14-12-09 15-05-29 unit mm max nom min 0.30 0.03 0.65 1.05 0.325 a dimensions (mm are the original dimensions) dsn1006u-2, leadless ultra small package; 2 terminals; body 1.0 x 0.6 x 0.27 mm sod995 a 1 b 0.51 0.55 0.95 0.49 dee 1 0.25 e 2 0 0.5 mm scale a a 1 e d l 1 l b b 12 0.26 0.24 l 0.41 0.39 l 1 0.24 (1) note 1. the marking bar indicates the cathode. e 1 e 2
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 6 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 3. pcb solder pattern 3.1 solder pad design: general options there are two types of solder pad / solder resist designs: solder mask defined (smd) and non-solder mask defined (nsmd). smd is a method of designing the solder resist to partially overlap the copper (cu) landing pattern on the pcb. nsmd designs have a gap between the solder resist and the cu landing pattern on the pcb. these two types are described in more detail in the next chapter. 3.1.1 smd solder pad versus nsmd solder pad if the solder mask exte nds onto the solder lands, the remaining solderable area is solder mask defined (smd). the effective solder p ad is equal to the copper area that is not covered by the solder mask. this situation is illustrated in figure 5 , left column. in case of an smd pad, the copper will normally extend 75 ? m down to 50 ? m underneath the solder mask on all sides. in other words, the copp er dimension is 0.1 mm to 0.15 mm larger than the solder mask dimension. these values may vary depending on the class of pcbs used. this allows tolerances in copper etching and solder mask placement during pcb production. if the solder mask layer starts outside of the solder lands, and does not cover the copper, this is referred to as non-so lder mask defined (nsmd). the effective solder pad is equal to the copper area. in case of an nsmd, the solder mask should be at least 50 ? m away from the solder land on all sides. in other words, the solder mask dimension is 100 ? m larger than the copper dimension. these values may vary depending on the class of pcbs used. the main requirement is that the solder mask is sufficiently far away from the copper, such that - with the given tolerances in solder mask application - it does not extend onto the copper. an nsmd footprint is shown in figure 5 , right column. a. smd solder pad b. nsmd solder pad fig 5. solder mask defined (s md) versus non-solder mask defined (nsmd) solder pads 001aac831 001aac832
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 7 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 3.2 solder pad design for ds n1006 packages (sod993, sod995) 3.2.1 recommended reflow solder footprints based on the small dimensions of 1006 (0402) devices and the given tolerances for pcb manufacturing, it is recommended to use non- solder mask defined (nsmd) solder pads. the dsn1006-2 (sod993) solder footprint with dimensions and the solder footprint together with the package outline are shown in figure 6 . a. reflow solder footprint b. reflow so lder footprint and package outline fig 6. recommended solder footprint for dsn1006-2 (sod993) aaa-019077 0.6 mm 0.35 mm 0.3 mm 0.35 mm 1 mm aaa-019078 0.6 mm 0.35 mm 0.3 mm 0.35 mm 0.5 mm 0.25 mm 0.25 mm 1 mm
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 8 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 the dsn1006u-2 (sod995) solder footprint with dimensions and the solder footprint together with the package outline are shown in figure 7 . a. reflow solder footprint b. reflow so lder footprint and package outline fig 7. recommended solder footprint for dsn1006u-2 (sod995) aaa-019079 0.6 mm 0.47 mm 0.13 mm 0.6 mm 1.2 mm aaa-019080 0.6 mm 0.5 mm 0.25 mm 0.4 mm 1 mm 0.47 mm 0.13 mm 0.6 mm 1.2 mm
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 9 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 4. solder stencil 4.1 stencil recommendations due to small apertures and pad dimensions, use a high-quality stainless-steel stencil manufactured by laser-cut and with electropolish or plasma coating. the recommended stencil thickness is 100 ? m for the dsn1006 packages. for the dsn1006-2 (sod993) recommended nxp footprint (see section 3.2.1 , figure 6 ), the optimum stencil aperture is shown in figure 8 . fig 8. recommended stencil aperture for dsn1006-2 (sod993) aaa-019081 0.5 mm 0.25 mm
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 10 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 for the dsn1006u-2 (sod995) recommended nxp footprint (see section 3.2.1 , figure 7 , the optimum stencil aperture is shown in figure 9 . fig 9. recommended stencil aperture for dsn1006u-2 (sod995) aaa-019082 0.5 mm 0.37 mm 0.5 mm
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 11 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 4.2 stencil aperture design area and aspect ratio are key design-guidelines for stencil apertures. the area ratio for a standard approach is > 0.66. smaller values are possible with adequate process control. of course, it depends on the manufacturing environment and other requirements of the manufacturer. the aspect ratio should be > 1.5 which is less critical to fulf il. for explanation of area and aspect ratio, refer to figure 10 . ta b l e 1 shows the values for aspect and area ratio of the optimum stencil apertures with a stencil thickness of 100 ? m. it results in acceptable area ratios for the nxp footprint recommendations. fig 10. explanation of area and aspect ratio table 1. area and aspect ratio for stencil apertures as recommended stencil thickness t = 100 ? m nxp recommended footprint aperture size area ratio target > 0.62 aspect ratio target > 1.5 dsn1006-2 (sod993) 250 ? 200 ? m 2 0.83 2.50 dsn1006u-2 (sod995) 370 / 500 ? 500 ? m 2 minimum 1.06 minimum 3.70 cross -sectional view of a stencil aaa-019083 area ratio area of aperture opening area of aperture walls ---------------------------------------------------------- lw ? 2lw + ?? t ?? -------------------------------------- == aspect ratio width of the aperture thickness of the stencil foil ---------------------------------------------------------------- w t ---- - 15 ?? ==
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 12 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 5. solder paste besides stencil aperture and thickness, the used solder paste has a significant impact on the printing performance. as shown in ta b l e 2 , solder pastes are available in different solder powder grain sizes. use a solder paste type 4 and higher (smalle r grain size) in combination with a stencil aperture thickness of 100 ? m for the dsn1006 (sod993, sod995) packages. as solder paste is sensitive to age, temperature, a nd humidity, follow the handling recommendations of the paste manufacturer. 6. soldering process for soldering of dsn1006 packages, following standard reflow processes and typical temperature profiles are suitable: ? convection reflow under nitrogen atmosphere is preferred to improve the solder wetting. ? convection reflow under air atmosphere also works, but solder joint surfaces are rough, flux residues often become darker and the soldering behavior may deteriorate. ? vapor phase soldering is also possible. a reflow solder profile for tin-silver-copper alloys, so-called sac alloys (snag3.8cu0.7) based on the ipc/jedec joint industry standard j-std-020d is recommended. refer to figure 11 and ta b l e 3 . table 2. solder paste types type powder grain size in ? m less than 0.5 % larger than 10 % max. between 80 % max between 10 % max. less than 1 160 150-160 75-150 75 2 80 75-80 45-75 45 3 60 45-60 25-45 25 4 50 38-50 20-38 20 5 40 25-40 15-25 15 6 25 15-25 5-15 5 7 15 11-15 2-11 2
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 13 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 7. handling recommendations besides the pcb and stencil design requiremen ts, the ultra small size of the dsn1006 and as consequence the low weight of the co mponent requires that some attention be paid to the pick and place (p&p) process. electrostatic charge may cause problems during the pick and place (tape out) process. nxp has implemented preventive measures such as using a conductive plastic carrier tape (embossed tape). for rework, use equipment suitable for the ultra small package size and for handling bare silicon devices. manual handling with tweezers (e.g. for repair) is not recommended. fig 11. reflow solder profile based on ipc/jedec j-std-020d table 3. pb-free profile feature and speci fication based on ipc/jedec j-std-020d profile feature values for pb-free assembly average ramp-up rate (t smax to t p )3 ?c/s maximum preheat minimum temperature (t smin ) 150 ?c maximum temperature (t smax ) 200 ?c time (t s ) from t smin to t smax 60 s to 180 s liquidus temperature (t l ) 217 ?c time (t l ) maintained above t l 60 s to 150 s peak/classification temperature (t p ) 260 ?c time within 5 ? c of actual peak temperature (t p ) 10 s to 30 s ramp-down rate 6 ?c/s maximum time 25 ? c to peak temperature (t 25c to peak ) 8 minutes maximum aaa-019084 ramp-down time t 25 c to peak t s preheat 25 c t l t smax t smin t p temperature ramp-up t p t l critical zone t l to t p
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 14 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 8. summary 8.1 recommended solder foot print and stencil aperture the recommended solder footprint including stencil aperture are shown in figure 12 for dsn1006-2 (sod993) and in figure 13 for dsn1006u-2 (sod995). recommended stencil thickness: 100 ? m fig 12. dsn1006-2 (sod993): solder footprint and stencil aperture sod993 sod993_fr occupied area solder paste solder resist solder lands dimensions in mm 15-02-20 15-03-05 0.5 (2x) 0.6 (2x) 0.7 (2x) 1.2 0.3 0.25 (2x) 0.2 0.35 (2x) 0.45 (2x) 0.65 0.8
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 15 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 8.2 further recommendations 8.2.1 stencil layout and solder paste ? stencil thickness of 100 ? m in combination with type 4 solder paste (refer to ta b l e 2 ) is recommended. ? a stencil aperture dimension as shown in figure 8 and figure 12 is recommended for dsn1006-2 (sod993). ? a stencil aperture dimension as shown in figure 9 and figure 13 is recommended for dsn1006u-2 (sod995). ? to get best printing (and soldering) result s, control the cleaning cycle of the stencil. 8.2.2 solder pad design ? non-solder mask defined (nsmd) pads with a gap between cu pad and solder resist of 50 ? m are recommended. ? conductor (cu trace) between solder pads on pcb is not recommended. ? do not connect solder pads by ? -via. ? connection by cu traces (lines) is preferred. recommended stencil thickness: 100 ? m fig 13. dsn1006u-2 (sod995): solder footprint and stencil aperture sod995 sod995_fr occupied area solder paste solder resist solder lands dimensions in mm 15-02-09 15-02-20 0.3 0.37 0.67 1.3 1.4 0.5 (2x) 0.6 (2x) 0.7 0.8 0.5 0.6 0.37 0.13 0.47
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 16 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 8.2.3 soldering process ? convection reflow under nitrogen atmosphere is preferred. ? convection reflow under air atmosphere also works, but: ? using an unfavorable layout, products le an towards undefined tilting and rotation and solder joints tend to increase voiding. ? solder joint surfaces are rough, flux residues often become darker and the soldering behavior may deteriorate. ? vapor phase soldering is also possible. 8.2.4 handling recommendations ? manual handling with tweezers (e.g. for repair) is not recommended. ? keep control of thawing time of solder pa ste bundle to avoid too much humidity in paste. ? to prevent drying of flux in solder paste, maintain the relative humidity of shop floor at solder paste print until reflow to 40 % to 60 %.
AN11689 all information provided in this document is subject to legal disclaimers. ? nxp semiconductors n.v. 2015. all rights res erved. application note rev. 1 ? 29 july 2015 17 of 18 nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 9. legal information 9.1 definitions draft ? the document is a draft versi on only. the content is still under internal review and subject to formal approval, which may result in modifications or additions. nxp semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall hav e no liability for the consequences of use of such information. 9.2 disclaimers limited warranty and liability ? information in this document is believed to be accurate and reliable. however, nxp semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such info rmation. nxp semiconductors takes no responsibility for the content in this document if provided by an information source outside of nxp semiconductors. in no event shall nxp semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. notwithstanding any damages that customer might incur for any reason whatsoever, nxp semiconductors? aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the terms and conditions of commercial sale of nxp semiconductors. right to make changes ? nxp semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. this document supersedes and replaces all information supplied prior to the publication hereof. suitability for use ? nxp semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an nxp semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. nxp semiconductors and its suppliers accept no liability for inclusion and/or use of nxp semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer?s own risk. applications ? applications that are described herein for any of these products are for illustrative purpos es only. nxp semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. customers are responsible for the design and operation of their applications and products using nxp semiconducto rs products, and nxp semiconductors accepts no liability for any assistance wi th applications or customer product design. it is customer?s sole responsibility to determine whether the nxp semiconductors product is suitable and fit for the customer?s applications and products planned, as well as fo r the planned application and use of customer?s third party customer(s). customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. nxp semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer?s applications or products, or the application or use by customer?s third party customer(s). customer is responsible for doing all necessary testing for the customer?s applic ations and products using nxp semiconductors products in order to av oid a default of the applications and the products or of the application or use by customer?s third party customer(s). nxp does not accept any liability in this respect. export control ? this document as well as the item(s) described herein may be subject to export control regulations. export might require a prior authorization from competent authorities. evaluation products ? this product is provided on an ?as is? and ?with all faults? basis for evaluati on purposes only. nxp semico nductors, its affiliates and their suppliers expressly disclaim all warranties, whether express, implied or statutory, including but not limited to the implied warranties of non-infringement, merchantability and fitness for a particular purpose. the entire risk as to the quality, or arising out of the use or performance, of this product remains with customer. in no event shall nxp semiconductors, its affiliates or their suppliers be liable to customer for any special, indirect, consequential, punitive or incidental damages (including without limitation damages for loss of business, business interruption, loss of use, loss of data or information, and the like) arising out the use of or inability to use the product, whether or not based on tort (including negligence), strict liability, breach of contract, breach of warranty or any other theory, even if advised of the possibility of such damages. notwithstanding any damages that customer might incur for any reason whatsoever (including without limitat ion, all damages referenced above and all direct or general damages), the entire liability of nxp semiconductors, its affiliates and their suppliers and custom er?s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars (us$5.00) . the foregoing limitations, exclusions and disclaimers shall apply to the ma ximum extent permitted by applicable law, even if any remedy fails of its essential purpose. translations ? a non-english (translated) version of a document is for reference only. the english version shall prevail in case of any discrepancy between the translated and english versions. 9.3 trademarks notice: all referenced brands, produc t names, service names and trademarks are the property of their respective owners.
nxp semiconductors AN11689 recommendations for pcb assembly of dsn1006 ? nxp semiconductors n.v. 2015. all rights reserved. for more information, please visit: http://www.nxp.com for sales office addresses, please se nd an email to: salesaddresses@nxp.com date of release: 29 july 2015 document identifier: AN11689 please be aware that important notices concerning this document and the product(s) described herein, have been included in section ?legal information?. 10. contents 1 introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 2 dsn1006 (sod993, sod995): package details 3 3 pcb solder pattern . . . . . . . . . . . . . . . . . . . . . . 6 3.1 solder pad design: general options . . . . . . . . . 6 3.1.1 smd solder pad versus nsmd solder pad . . . . 6 3.2 solder pad design for dsn1006 packages (sod993, sod995) . . . . . . . . . . . . . . . . . . . . . 7 3.2.1 recommended reflow solder footprints . . . . . . 7 4 solder stencil . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4.1 stencil recommendations . . . . . . . . . . . . . . . . . 9 4.2 stencil aperture design . . . . . . . . . . . . . . . . . . 11 5 solder paste . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 6 soldering process . . . . . . . . . . . . . . . . . . . . . . 12 7 handling recommendations . . . . . . . . . . . . . . 13 8 summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.1 recommended solder footprint and stencil aperture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 8.2 further recommendations . . . . . . . . . . . . . . . 15 8.2.1 stencil layout and solder paste . . . . . . . . . . . . 15 8.2.2 solder pad design. . . . . . . . . . . . . . . . . . . . . . 15 8.2.3 soldering process . . . . . . . . . . . . . . . . . . . . . . 16 8.2.4 handling recommendations . . . . . . . . . . . . . . 16 9 legal information. . . . . . . . . . . . . . . . . . . . . . . 17 9.1 definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.2 disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 9.3 trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 17 10 contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18

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